Advanced Micro Devices, Nvidia Corp. and Via Technologies have not yet started development of their own next-generation universal serial bus (US
controller as they cannot get specifications of the bus from Intel Corp. The latter denies any wrongdoing or intention to affect competitive positions of AMD, Nvidia and others as well as claims that the spec is not finalized. “The challenge is that Intel is not... giving the specification to anybody that competes with CPUs and chipsets,” a source close to AMD who is familiar with the dispute between chipset developers and Intel is reported to have said by News.com web-site.
While retaining full backward compatibility with USB 1.0 and USB 2.0, devices that feature USB 3.0 will be able to transfer data at up to 10 times higher speed compared to USB 2.0, or at 4.8Gb/s, meaning that a file as large as 600MB could be transferred in just a second in the best case scenario. In addition, the USB 3.0 specification will be optimized for low power and improved protocol efficiency. USB 3.0 ports and cabling will be designed to enable backward compatibility as well as future-proofing for optical capabilities.
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