*Source: OCIA (
http://www.ocia.net/reviews/vendetta/page1.shtml)*
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As I mentioned earlier, the base is designed so that the three heatpipes will directly touch the CPU's heatspreader. I'm not a thermal engineer, but I do realize that there is some efficiency loss when transferring heat from one substrate to another, such as from the heatsink base to the heatpipes contained within.
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