Intel today said that it has reached an agreement with Samsung and TSMC to enable a 450 mm wafer-based chip production by 2012. Like the transition to 300 mm, which Intel introduced with its 130 nm processor generation in 2001, 450 mm wafers will help the semiconductor industry to scale the economics of chip manufacturing. Intel is expected to use the technology first for its 22 nm products, which are expected to debut in late 2011.
*Source: TG Daily (
http://www.tgdaily.com/content/view/37278/135/)*
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